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Number of items: 3.

Article

Rajaguru, P., Lu, H., Bailey, C., Castellazzi, A., Pathirana, V., Udugampola, N. and Udrea, F. (2018) Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables. Microelectronics Reliability, 83 . pp. 146-156. ISSN 0026-2714

Conference or Workshop Item

Rajaguru, P., Bailey, Christopher, Aliyu, Attahir Murtala, Castellazzi, Alberto, Pathirana, V., Udugampola, N., Trajkovic, T., Udrea, F., Mitchelson, P.D. and Elliot, A.D.T. (2017) Co-design/simulation of flip-chip assembly for high voltage IGBT packages. In: 23rd International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2017, 27-29 September 2018, Amsterdam, Netherlands.

Aliyu, Attahir Murtala, Mouawad, Bassem, Castellazzi, Alberto, Rajaguru, P., Bailey, C., Pathirana, V., Udugampola, N., Trajkovic, T. and Udrea, F. (2017) Chip-on-board assembly of 800V Si L-IGBTs for high performance ultra-compact LED drivers. In: 29th International Symposium on Power Semiconductor Devices and ICs (ISPSD 2017), 28 May - 1 June 2017, Sapporo, Japan.

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