Chip-on-board assembly of 800V Si L-IGBTs for high performance ultra-compact LED drivers

Aliyu, Attahir Murtala, Mouawad, Bassem, Castellazzi, Alberto, Rajaguru, P., Bailey, C., Pathirana, V., Udugampola, N., Trajkovic, T. and Udrea, F. (2017) Chip-on-board assembly of 800V Si L-IGBTs for high performance ultra-compact LED drivers. In: 29th International Symposium on Power Semiconductor Devices and ICs (ISPSD 2017), 28 May - 1 June 2017, Sapporo, Japan.

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This paper presents a novel chip on board assembly design for an integrated power switch, based on high power density 800V silicon lateral insulated-gate bipolar transistor (Si LIGBT) technology. LIGBTs offer much higher current densities (5-10X), significantly lower leakage currents, and lower parasitic device capacitances and, gate charge compared to conventional vertical MOSFETs commonly used in LED drivers. The higher voltage ratings offered (up to 1kV), the development of high voltage interconnection between parallel IGBTs, self-isolated nature and absence of termination region unlike in a vertical MOSFET makes these devices ideal for ultra-compact, low bill of materials (BOM) count LED drives. Chip on-board LIGBTs also offer significant advantages over MOSFETs due to high ambient temperatures seen on most of the LED lamps as the LIGBTs on-state losses increase only marginally with temperature. The design is based on a built-in reliability approach which focuses on a compact LED driver as a case-study of a cost-sensitive large volume production item.

Item Type: Conference or Workshop Item (Paper)
Additional Information: Published in: Proceedings of the 29th International Symposium on Power Semiconductor Devices and ICs, 28 May-1 June 2017, Sapporo, Japan, p. 431-434. ISSN 1946-0201. doi:10.23919/ISPSD.2017.7988976 © 2017 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
Keywords: chip-on-board; lateral IGBT; LED drivers; packaging; reliability
Schools/Departments: University of Nottingham, UK > Faculty of Engineering > Department of Electrical and Electronic Engineering
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Depositing User: Burns, Rebecca
Date Deposited: 12 Oct 2017 13:21
Last Modified: 04 May 2020 18:56

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