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Conference or Workshop Item

Rajaguru, P. and Bailey, Christopher and Aliyu, Attahir Murtala and Castellazzi, Alberto and Pathirana, V. and Udugampola, N. and Trajkovic, T. and Udrea, F. and Mitchelson, P.D. and Elliot, A.D.T. (2017) Co-design/simulation of flip-chip assembly for high voltage IGBT packages. In: 23rd International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2017, 27-29 September 2018, Amsterdam, Netherlands.

Aliyu, Attahir Murtala and Mouawad, Bassem and Castellazzi, Alberto and Rajaguru, P. and Bailey, C. and Pathirana, V. and Udugampola, N. and Trajkovic, T. and Udrea, F. (2017) Chip-on-board assembly of 800V Si L-IGBTs for high performance ultra-compact LED drivers. In: 29th International Symposium on Power Semiconductor Devices and ICs (ISPSD 2017), 28 May - 1 June 2017, Sapporo, Japan.

This list was generated on Sun Feb 28 15:37:26 2021 UTC.