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Arjmand, Elaheh, Agyakwa, Pearl A., Corfield, Martin R., Li, Jianfeng, Mouawad, Bassem and Mark Johnson, C. (2016) A thermal cycling reliability study of ultrasonically bonded copper wires. Microelectronics Reliability, 59 . pp. 126-133. ISSN 0026-2714

Conference or Workshop Item

Mouawad, Bassem, Abebe, Robert, Skuriat, Robert, Li, Jianfeng, De Lillo, Liliana, Empringham, Lee, Johnson, C. Mark, Roberts, Andy, Clarke, Robert and Haynes, Geoff (2018) Cost effective direct-substrate jet impingement cooling concept for power application. In: PCIM 2018 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, 5-7 June 2018, Nuremberg, Germany.

Hussein, Abdallah, Mouawad, Bassem and Castellazzi, Alberto (2018) Dynamic performance analysis of a 3.3 kV SiC MOSFET half-bridge module with parallel chips and body-diode freewheeling. In: 2018 IEEE 30th International Symposium on Power Semiconductor Devices and ICs (ISPSD), 13-17 May 2018, Chicago, USA.

DiMarino, C., Mouawad, Bassem, Skuriat, Robert, Li, Ke, Xu, L., Johnson, Christopher Mark and Boroyevich, D. (2018) A wire-bond-less 10 KV SiC MOSFET power module with reduced common-mode noise and electric field. In: PCIM 2018 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, 5-7 June 2018, Nuremberg, Germany.

Mouawad, Bassem, Espina, Jordi, Li, Jianfeng, Empringham, Lee and Johnson, Christopher Mark (2018) Novel silicon carbide integrated power module for EV application. In: WiPDA 2018 - IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia, 17-19 May 2018, XI' AN Shaanxi, China.

Aliyu, Attahir Murtala, Mouawad, Bassem, Castellazzi, Alberto, Rajaguru, P., Bailey, C., Pathirana, V., Udugampola, N., Trajkovic, T. and Udrea, F. (2017) Chip-on-board assembly of 800V Si L-IGBTs for high performance ultra-compact LED drivers. In: 29th International Symposium on Power Semiconductor Devices and ICs (ISPSD 2017), 28 May - 1 June 2017, Sapporo, Japan.

Mouawad, Bassem, Wang, Zhenyu, Buettner, J. and Castellazzi, Alberto (2017) 3.3 kV SiC JBS diode configurable rectifier module. In: EPE-ECCE 2017, 11-14 Sept 2017, Warsaw, Poland. (In Press)

Mouawad, Bassem, Li, Jianfeng, Castellazzi, Alberto and Johnson, Christopher Mark (2016) Reliable integration of a high performance multi-chip half-bridge SiC power module. In: 6th Electronics System-Integration Technology Conference (ESTC’16), 13-16 Sept. 2016, Grenoble, France.

Li, Jianfeng, Mouawad, Bassem, Castellazzi, Alberto, Friedrichs, Peter and Johnson, Christopher Mark (2016) Low parasitic inductance multi-chip SiC devices packaging technology. In: 18th European Conference on Power Electronics and Applications, 5-9 September 2016, Karlsruhe, Germany.

Mouawad, Bassem, Li, Jianfeng, Castellazzi, Alberto, Johnson, Christopher Mark, Erlbacher, Tobias and Friedriches, Peter (2016) Low inductance 2.5kV packaging technology for SiC switches. In: 9th International Conference on Integrated Power Electronics Systems, 08-10 Mar 2016, Nuremberg, Germany.

Mouawad, Bassem, Li, Jianfeng, Castellazzi, Alberto and Johnson, Christopher Mark (2015) Hybrid half-bridge package for high voltage application. In: 28th International Symposium on Power Semiconductor Devices and ICs (ISPSD), 12-16 June 2016, Prague, Czech Republic.