Browse by Authors and Editors
Number of items: 1. Rajaguru, P., Bailey, Christopher, Aliyu, Attahir Murtala, Castellazzi, Alberto, Pathirana, V., Udugampola, N., Trajkovic, T., Udrea, F., Mitchelson, P.D. and Elliot, A.D.T. (2017) Co-design/simulation of flip-chip assembly for high voltage IGBT packages. In: 23rd International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2017, 27-29 September 2018, Amsterdam, Netherlands. |
