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Li, Jianfeng, Dai, Jingru and Johnson, Christopher Mark (2018) Comparison of power cycling reliability of flexible PCB interconnect smaller/thinner and larger/thicker power devices with topside Sn-3.5Ag solder joints. Microelectronics Reliability, 84 . pp. 55-65. ISSN 0026-2714

Dai, Jingru, Li, Jianfeng, Agyakwa, Pearl, Corfield, Martin and Johnson, Christopher Mark (2018) Comparative thermal and structural characterization of sintered nano-silver and high-lead solder die attachments during power cycling. IEEE Transactions on Device and Materials Reliability . ISSN 1530-4388 (In Press)

Zhang, Hui, Li, Jianfeng, Dai, Jingru, Corfield, Martin, Liu, Xuejian, Liu, Yan, Huang, Zhengren and Johnson, Christopher Mark (2018) Improved reliability of planar power interconnect with ceramic-based structure. IEEE Journal of Emerging and Selected Topics in Power Electronics, 6 (1). pp. 175-187. ISSN 2168-6785

Dai, Jingru, Li, Jianfeng, Agyakwa, Pearl and Johnson, Christopher Mark (2017) Time-efficient sintering processes to attach power devices using nanosilver dry film. Journal of Microelectronics and Electronic Packaging, 14 (4). pp. 140-149. ISSN 1551-4897

Li, Jianfeng, Castellazzi, Alberto, Eleffendi, Mohd Amir, Gurpinar, Emre, Johnson, Christopher Mark and Mills, Liam (2017) A physical RC network model for electro-thermal analysis of a multichip SiC power module. IEEE Transactions on Power Electronics, 33 (3). pp. 2494-2508. ISSN 0885-8993

Li, Jianfeng, Yaqub, Imran, Corfield, Martin and Johnson, Christopher Mark (2017) Interconnect materials enabling IGBT modules to achieve stable short circuit failure behavior. IEEE Transactions on Components, Packaging, and Manufacturing Technology, 7 (5). pp. 734-744. ISSN 2156-3950

Billore, Justine, Hascoët, Stanislas, Robutel, Rémi, Buttay, Cyril and Li, Jianfeng (2017) Sintered-silver bonding of high-temperature piezoelectric ceramic sensors. IEEE Transactions on Components, Packaging and Manufacturing Technology, 7 (1). pp. 3-9. ISSN 2156-3985

Arjmand, Elahjeh, Agyakwa, Pearl, Corfield, Martin, Li, Jianfeng and Johnson, Christopher Mark (2016) Predicting lifetime of thick Al wire bonds using signals obtained from ultrasonic generator. IEEE Transactions on Components, Packaging and Manufacturing Technology, 6 (5). pp. 814-821. ISSN 2156-3985

Arjmand, Elaheh, Agyakwa, Pearl A., Corfield, Martin R., Li, Jianfeng, Mouawad, Bassem and Mark Johnson, C. (2016) A thermal cycling reliability study of ultrasonically bonded copper wires. Microelectronics Reliability, 59 . pp. 126-133. ISSN 0026-2714

Li, Jianfeng, Agyakwa, Pearl A. and Johnson, C. Mark (2016) Response to comments on “A numerical method to determine interdiffusion coefficients of Cu6Sn5 and Cu3Sn intermetallic compounds”. Intermetallics, 69 . pp. 128-130. ISSN 0966-9795

Yaqub, Imran, Li, Jianfeng and Johnson, Christopher Mark (2015) Dependence of overcurrent failure modes of IGBT modules on interconnect technologies. Microelectronics Reliability, 55 (12). pp. 2596-2605. ISSN 0026-2714

Li, Jianfeng, Castellazzi, Alberto, Dai, Tianxiang, Corfield, Martin, Solomon, Adane Kassa and Johnson, Christopher Mark (2015) Built-in reliability design of highly integrated solid-state power switches with metal bump interconnects. IEEE Transactions on Power Electronics, 30 (5). pp. 2587-2600. ISSN 0885-8993

Li, Jianfeng, Castellazzi, Alberto, Dai, Tianxiang, Corfield, Martin, Solomon, Adane Kassa and Johnson, Christopher Mark (2015) Built-in reliability design of highly integrated solid-state power switches with metal bump interconnects. IEEE Transactions on Power Electronics, 30 (5). pp. 2587-2600. ISSN 0885-8993

Li, Jianfeng, Johnson, Christopher Mark, Buttay, Cyril, Sabbah, Wissam and Azzopardi, Stéphane (2015) Bonding strength of multiple SiC die attachment prepared by sintering of Ag nanoparticles. Journal of Materials Processing Technology, 215 . pp. 299-308. ISSN 0924-0136

Solomon, Adane Kassa, Li, Jianfeng, Castellazzi, Alberto and Johnson, Christopher Mark (2015) Integrated half-bridge switch using 70-μm-thin devices and hollow interconnects. IEEE Transactions on Industry Applications, 51 (1). pp. 556-566. ISSN 1939-9367

Wang, Yun, Li, Jianfeng, Agyakwa, Pearl, Johnson, Christopher Mark and Li, Shuguang (2014) Quantitative microstructure characterization of Ag nanoparticle sintered joints for power die attachment. Molecular Crystals and Liquid Crystals, 604 (1). pp. 11-26. ISSN 1542-1406

Li, Jianfeng, Agyakwa, Pearl and Johnson, Christopher Mark (2014) Suitable thicknesses of base metal and interlayer, and evolution of phases for Ag/Sn/Ag transient liquid-phase joints used for power die attachment. Journal of Electronic Materials, 43 (4). pp. 983-995. ISSN 0361-5235

Conference or Workshop Item

Mouawad, Bassem, Abebe, Robert, Skuriat, Robert, Li, Jianfeng, De Lillo, Liliana, Empringham, Lee, Johnson, C. Mark, Roberts, Andy, Clarke, Robert and Haynes, Geoff (2018) Cost effective direct-substrate jet impingement cooling concept for power application. In: PCIM 2018 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, 5-7 June 2018, Nuremberg, Germany.

Mouawad, Bassem, Espina, Jordi, Li, Jianfeng, Empringham, Lee and Johnson, Christopher Mark (2018) Novel silicon carbide integrated power module for EV application. In: WiPDA 2018 - IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia, 17-19 May 2018, XI' AN Shaanxi, China.

Lin, Xi, Li, Jianfeng and Johnson, Mark (2017) Design and construction of a co-planar power bus interconnect for low inductance switching. In: 2017 IEEE International Workshop On Integrated Power Packaging (IWIPP), 5-7 April 2017, Delft, Netherlands.

Li, Jianfeng, Yaqub, Imran and Johnson, Christopher Mark (2016) Selection of materials for IGBT modules to achieve stable short circuit failure behaviour. In: PCIM Asia 2016, 28-30 June 2016, Shanghai, China.

Mouawad, Bassem, Li, Jianfeng, Castellazzi, Alberto and Johnson, Christopher Mark (2016) Reliable integration of a high performance multi-chip half-bridge SiC power module. In: 6th Electronics System-Integration Technology Conference (ESTC’16), 13-16 Sept. 2016, Grenoble, France.

Li, Jianfeng, Mouawad, Bassem, Castellazzi, Alberto, Friedrichs, Peter and Johnson, Christopher Mark (2016) Low parasitic inductance multi-chip SiC devices packaging technology. In: 18th European Conference on Power Electronics and Applications, 5-9 September 2016, Karlsruhe, Germany.

Mouawad, Bassem, Li, Jianfeng, Castellazzi, Alberto, Johnson, Christopher Mark, Erlbacher, Tobias and Friedriches, Peter (2016) Low inductance 2.5kV packaging technology for SiC switches. In: 9th International Conference on Integrated Power Electronics Systems, 08-10 Mar 2016, Nuremberg, Germany.

Mouawad, Bassem, Li, Jianfeng, Castellazzi, Alberto and Johnson, Christopher Mark (2015) Hybrid half-bridge package for high voltage application. In: 28th International Symposium on Power Semiconductor Devices and ICs (ISPSD), 12-16 June 2016, Prague, Czech Republic.

Li, Jianfeng, Gurpinar, Emre, Lopez Arevalo, Saul, Castellazzi, Alberto and Mills, Liam (2014) Built-in reliability design of a high-frequency SiC MOSFET power module. In: 7th International Power Electronics Conference (IPEC Hiroshima 2014 ECCE- ASIA), 18-21 May 2014, Hiroshima, Japan.

Gurpinar, Emre, Lopez Arevalo, Saul, Li, Jianfeng, De, D., Castellazzi, Alberto and Mills, Liam (2014) Testing of a lightweight SiC power module for avionic applications. In: 7th IET International Conference on Power Electronics, Machines and Drives (PEMD 2014), 8-10 April 2014, Manchester, UK.

Li, Jianfeng, Agyakwa, Pearl, Evans, Paul, Johnson, Christopher Mark, Zhao, Yimin, Wu, Yibo and Evans, Kim (2014) Packaging/assembling technologies for a high performance SiC-based planar power module. In: Greener Aviation Conference 2014: Clean Sky Breakthrough and Worldwide Status, 12-14 March 2014, Brussels, Belgium.