Design and construction of a co-planar power bus interconnect for low inductance switching

Lin, Xi, Li, Jianfeng and Johnson, Mark (2017) Design and construction of a co-planar power bus interconnect for low inductance switching. In: 2017 IEEE International Workshop On Integrated Power Packaging (IWIPP), 5-7 April 2017, Delft, Netherlands.

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A co-planar tab-slot type of interconnect demonstrator for connecting power switching devices and DC bus capacitors has been designed and constructed, aimed at low inductance switching. The demonstrator is composed of a double-sided tab connector and a dual polarity slot. This type of interconnect eliminates the use of screw terminal connection between a power module and the DC bus as well as between the DC bus and power capacitors, thus serves to maintain a coplanar current profile throughout the power distribution path. Parasitic analysis both in impedance testing and in Finite Element simulation suggests that the inductance in the bus loop of the demonstrator is approximately half of that achieved in an equally dimensioned busbar with conventional screw terminals.

Item Type: Conference or Workshop Item (Paper)
Additional Information: © 2017 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
Keywords: Inductance, Multichip modules, Conductors, Plastics, Connectors
Schools/Departments: University of Nottingham, UK > Faculty of Engineering > Department of Electrical and Electronic Engineering
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Depositing User: Eprints, Support
Date Deposited: 07 Aug 2017 11:51
Last Modified: 04 May 2020 18:41

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