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Yang, Li, Li, Ke, Dai, Jingru, Corfield, Martin, Harris, Anne, Paciura, Krzysztof, O'Brien, John and Johnson, C. Mark (2018) Electrical performance and reliability characterization of a SiC MOSFET power module with embedded decoupling capacitors. IEEE Transactions on Power Electronics, 33 (12). pp. 10594-10601. ISSN 1941-0107

Bodo, Nandor, Levi, Emil, Subotic, Ivan, Espina, Jordi, Empringham, Lee and Johnson, C. Mark (2016) Efficiency evaluation of fully integrated on-board EV battery chargers With nine-phase machines. IEEE Transactions on Energy Conversion, 32 (1). pp. 257-266. ISSN 0885-8969

Eleffendi, Mohd. Amir, Yang, Li, Agyakwa, Pearl and Johnson, C. Mark (2016) Quantification of cracked area in thermal path of high-powermulti-chip modules using transient thermal impedance measurement. Microelectronics Reliability, 59 . pp. 73-83. ISSN 0026-2714

Evans, Paul L., Castellazzi, Alberto and Johnson, C. Mark (2016) Design tools for rapid multidomain prototyping of power electronic systems. IEEE Transactions on Power Electronics, 31 (3). pp. 2443-2455. ISSN 0885-8993

Li, Jianfeng, Agyakwa, Pearl A. and Johnson, C. Mark (2016) Response to comments on “A numerical method to determine interdiffusion coefficients of Cu6Sn5 and Cu3Sn intermetallic compounds”. Intermetallics, 69 . pp. 128-130. ISSN 0966-9795

Musallam, Mahera, Yin, Chunyan, Bailey, Chris and Johnson, C. Mark (2014) Application of coupled electro-thermal and physics-of-failure-based analysis to the design of accelerated life tests for power modules. Microelectronics Reliability, 54 (1). pp. 172-181. ISSN 0026-2714

Yang, Li, Agyakwa, Pearl A. and Johnson, C. Mark (2013) Physics-of-failure lifetime prediction models for wire bond interconnects in power electronic modules. IEEE Transactions on Device and Materials Reliability, 13 (1). pp. 9-17. ISSN 1530-4388

Conference or Workshop Item

Mouawad, Bassem, Abebe, Robert, Skuriat, Robert, Li, Jianfeng, De Lillo, Liliana, Empringham, Lee, Johnson, C. Mark, Roberts, Andy, Clarke, Robert and Haynes, Geoff (2018) Cost effective direct-substrate jet impingement cooling concept for power application. In: PCIM 2018 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, 5-7 June 2018, Nuremberg, Germany.