Browse by Authors and Editors
Number of items: 8. 2018Mouawad, Bassem, Abebe, Robert, Skuriat, Robert, Li, Jianfeng, De Lillo, Liliana, Empringham, Lee, Johnson, C. Mark, Roberts, Andy, Clarke, Robert and Haynes, Geoff (2018) Cost effective direct-substrate jet impingement cooling concept for power application. In: PCIM 2018 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, 5-7 June 2018, Nuremberg, Germany. Yang, Li, Li, Ke, Dai, Jingru, Corfield, Martin, Harris, Anne, Paciura, Krzysztof, O'Brien, John and Johnson, C. Mark (2018) Electrical performance and reliability characterization of a SiC MOSFET power module with embedded decoupling capacitors. IEEE Transactions on Power Electronics, 33 (12). pp. 10594-10601. ISSN 1941-0107 2016Bodo, Nandor, Levi, Emil, Subotic, Ivan, Espina, Jordi, Empringham, Lee and Johnson, C. Mark (2016) Efficiency evaluation of fully integrated on-board EV battery chargers With nine-phase machines. IEEE Transactions on Energy Conversion, 32 (1). pp. 257-266. ISSN 0885-8969 Eleffendi, Mohd. Amir, Yang, Li, Agyakwa, Pearl and Johnson, C. Mark (2016) Quantification of cracked area in thermal path of high-powermulti-chip modules using transient thermal impedance measurement. Microelectronics Reliability, 59 . pp. 73-83. ISSN 0026-2714 Evans, Paul L., Castellazzi, Alberto and Johnson, C. Mark (2016) Design tools for rapid multidomain prototyping of power electronic systems. IEEE Transactions on Power Electronics, 31 (3). pp. 2443-2455. ISSN 0885-8993 Li, Jianfeng, Agyakwa, Pearl A. and Johnson, C. Mark (2016) Response to comments on “A numerical method to determine interdiffusion coefficients of Cu6Sn5 and Cu3Sn intermetallic compounds”. Intermetallics, 69 . pp. 128-130. ISSN 0966-9795 2014Musallam, Mahera, Yin, Chunyan, Bailey, Chris and Johnson, C. Mark (2014) Application of coupled electro-thermal and physics-of-failure-based analysis to the design of accelerated life tests for power modules. Microelectronics Reliability, 54 (1). pp. 172-181. ISSN 0026-2714 2013Yang, Li, Agyakwa, Pearl A. and Johnson, C. Mark (2013) Physics-of-failure lifetime prediction models for wire bond interconnects in power electronic modules. IEEE Transactions on Device and Materials Reliability, 13 (1). pp. 9-17. ISSN 1530-4388 |
