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Jump to: 2018 | 2017 | 2016 | 2015
Number of items: 11.

2018

Mouawad, Bassem and Abebe, Robert and Skuriat, Robert and Li, Jianfeng and De Lillo, Liliana and Empringham, Lee and Johnson, C. Mark and Roberts, Andy and Clarke, Robert and Haynes, Geoff (2018) Cost effective direct-substrate jet impingement cooling concept for power application. In: PCIM 2018 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, 5-7 June 2018, Nuremberg, Germany.

Hussein, Abdallah and Mouawad, Bassem and Castellazzi, Alberto (2018) Dynamic performance analysis of a 3.3 kV SiC MOSFET half-bridge module with parallel chips and body-diode freewheeling. In: 2018 IEEE 30th International Symposium on Power Semiconductor Devices and ICs (ISPSD), 13-17 May 2018, Chicago, USA.

DiMarino, C. and Mouawad, Bassem and Skuriat, Robert and Li, Ke and Xu, L. and Johnson, Christopher Mark and Boroyevich, D. (2018) A wire-bond-less 10 KV SiC MOSFET power module with reduced common-mode noise and electric field. In: PCIM 2018 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, 5-7 June 2018, Nuremberg, Germany.

Mouawad, Bassem and Espina, Jordi and Li, Jianfeng and Empringham, Lee and Johnson, Christopher Mark (2018) Novel silicon carbide integrated power module for EV application. In: WiPDA 2018 - IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia, 17-19 May 2018, XI' AN Shaanxi, China.

2017

Aliyu, Attahir Murtala and Mouawad, Bassem and Castellazzi, Alberto and Rajaguru, P. and Bailey, C. and Pathirana, V. and Udugampola, N. and Trajkovic, T. and Udrea, F. (2017) Chip-on-board assembly of 800V Si L-IGBTs for high performance ultra-compact LED drivers. In: 29th International Symposium on Power Semiconductor Devices and ICs (ISPSD 2017), 28 May - 1 June 2017, Sapporo, Japan.

Mouawad, Bassem and Wang, Zhenyu and Buettner, J. and Castellazzi, Alberto (2017) 3.3 kV SiC JBS diode configurable rectifier module. In: EPE-ECCE 2017, 11-14 Sept 2017, Warsaw, Poland. (In Press)

2016

Mouawad, Bassem and Li, Jianfeng and Castellazzi, Alberto and Johnson, Christopher Mark (2016) Reliable integration of a high performance multi-chip half-bridge SiC power module. In: 6th Electronics System-Integration Technology Conference (ESTC’16), 13-16 Sept. 2016, Grenoble, France.

Arjmand, Elaheh and Agyakwa, Pearl A. and Corfield, Martin R. and Li, Jianfeng and Mouawad, Bassem and Mark Johnson, C. (2016) A thermal cycling reliability study of ultrasonically bonded copper wires. Microelectronics Reliability, 59 . pp. 126-133. ISSN 0026-2714

Li, Jianfeng and Mouawad, Bassem and Castellazzi, Alberto and Friedrichs, Peter and Johnson, Christopher Mark (2016) Low parasitic inductance multi-chip SiC devices packaging technology. In: 18th European Conference on Power Electronics and Applications, 5-9 September 2016, Karlsruhe, Germany.

Mouawad, Bassem and Li, Jianfeng and Castellazzi, Alberto and Johnson, Christopher Mark and Erlbacher, Tobias and Friedriches, Peter (2016) Low inductance 2.5kV packaging technology for SiC switches. In: 9th International Conference on Integrated Power Electronics Systems, 08-10 Mar 2016, Nuremberg, Germany.

2015

Mouawad, Bassem and Li, Jianfeng and Castellazzi, Alberto and Johnson, Christopher Mark (2015) Hybrid half-bridge package for high voltage application. In: 28th International Symposium on Power Semiconductor Devices and ICs (ISPSD), 12-16 June 2016, Prague, Czech Republic.

This list was generated on Tue Sep 25 02:10:14 2018 UTC.