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Number of items: 23.

Article

Zhang, Hui and Li, Jianfeng and Dai, Jingru and Corfield, Martin and Liu, Xuejian and Liu, Yan and Huang, Zhengren and Johnson, Christopher Mark (2017) Improved reliability of planar power interconnect with ceramic-based structure. IEEE Journal of Emerging and Selected Topics in Power Electronics . ISSN 2168-6785 (In Press)

Li, Jianfeng and Castellazzi, Alberto and Eleffendi, Mohd Amir and Gurpinar, Emre and Johnson, Christopher Mark and Mills, Liam (2017) A physical RC network model for electro-thermal analysis of a multichip SiC power module. IEEE Transactions on Power Electronics . ISSN 0885-8993

Li, Jianfeng and Yaqub, Imran and Corfield, Martin and Johnson, Christopher Mark (2017) Interconnect materials enabling IGBT modules to achieve stable short circuit failure behavior. IEEE Transactions on Components, Packaging, and Manufacturing Technology, 7 (5). pp. 734-744. ISSN 2156-3950

Billore, Justine and Hascoët, Stanislas and Robutel, Rémi and Buttay, Cyril and Li, Jianfeng (2017) Sintered-silver bonding of high-temperature piezoelectric ceramic sensors. IEEE Transactions on Components, Packaging and Manufacturing Technology, 7 (1). pp. 3-9. ISSN 2156-3985

Arjmand, Elahjeh and Agyakwa, Pearl and Corfield, Martin and Li, Jianfeng and Johnson, Christopher Mark (2016) Predicting lifetime of thick Al wire bonds using signals obtained from ultrasonic generator. IEEE Transactions on Components, Packaging and Manufacturing Technology, 6 (5). pp. 814-821. ISSN 2156-3985

Arjmand, Elaheh and Agyakwa, Pearl A. and Corfield, Martin R. and Li, Jianfeng and Mouawad, Bassem and Mark Johnson, C. (2016) A thermal cycling reliability study of ultrasonically bonded copper wires. Microelectronics Reliability, 59 . pp. 126-133. ISSN 0026-2714

Li, Jianfeng and Agyakwa, Pearl A. and Johnson, C. Mark (2016) Response to comments on “A numerical method to determine interdiffusion coefficients of Cu6Sn5 and Cu3Sn intermetallic compounds”. Intermetallics, 69 . pp. 128-130. ISSN 0966-9795

Yaqub, Imran and Li, Jianfeng and Johnson, Christopher Mark (2015) Dependence of overcurrent failure modes of IGBT modules on interconnect technologies. Microelectronics Reliability, 55 (12). pp. 2596-2605. ISSN 0026-2714

Li, Jianfeng and Castellazzi, Alberto and Dai, Tianxiang and Corfield, Martin and Solomon, Adane Kassa and Johnson, Christopher Mark (2015) Built-in reliability design of highly integrated solid-state power switches with metal bump interconnects. IEEE Transactions on Power Electronics, 30 (5). pp. 2587-2600. ISSN 0885-8993

Li, Jianfeng and Castellazzi, Alberto and Dai, Tianxiang and Corfield, Martin and Solomon, Adane Kassa and Johnson, Christopher Mark (2015) Built-in reliability design of highly integrated solid-state power switches with metal bump interconnects. IEEE Transactions on Power Electronics, 30 (5). pp. 2587-2600. ISSN 0885-8993

Li, Jianfeng and Johnson, Christopher Mark and Buttay, Cyril and Sabbah, Wissam and Azzopardi, Stéphane (2015) Bonding strength of multiple SiC die attachment prepared by sintering of Ag nanoparticles. Journal of Materials Processing Technology, 215 . pp. 299-308. ISSN 0924-0136

Solomon, Adane Kassa and Li, Jianfeng and Castellazzi, Alberto and Johnson, Christopher Mark (2015) Integrated half-bridge switch using 70-μm-thin devices and hollow interconnects. IEEE Transactions on Industry Applications, 51 (1). pp. 556-566. ISSN 1939-9367

Wang, Yun and Li, Jianfeng and Agyakwa, Pearl and Johnson, Christopher Mark and Li, Shuguang (2014) Quantitative microstructure characterization of Ag nanoparticle sintered joints for power die attachment. Molecular Crystals and Liquid Crystals, 604 (1). pp. 11-26. ISSN 1542-1406

Li, Jianfeng and Agyakwa, Pearl and Johnson, Christopher Mark (2014) Suitable thicknesses of base metal and interlayer, and evolution of phases for Ag/Sn/Ag transient liquid-phase joints used for power die attachment. Journal of Electronic Materials, 43 (4). pp. 983-995. ISSN 0361-5235

Conference or Workshop Item

Lin, Xi and Li, Jianfeng and Johnson, Mark (2017) Design and construction of a co-planar power bus interconnect for low inductance switching. In: 2017 IEEE International Workshop On Integrated Power Packaging (IWIPP), 5-7 April 2017, Delft, Netherlands.

Li, Jianfeng and Yaqub, Imran and Johnson, Christopher Mark (2016) Selection of materials for IGBT modules to achieve stable short circuit failure behaviour. In: PCIM Asia 2016, 28-30 June 2016, Shanghai, China.

Mouawad, Bassem and Li, Jianfeng and Castellazzi, Alberto and Johnson, Christopher Mark (2016) Reliable integration of a high performance multi-chip half-bridge SiC power module. In: 6th Electronics System-Integration Technology Conference (ESTC’16), 13-16 Sept. 2016, Grenoble, France.

Li, Jianfeng and Mouawad, Bassem and Castellazzi, Alberto and Friedrichs, Peter and Johnson, Christopher Mark (2016) Low parasitic inductance multi-chip SiC devices packaging technology. In: 18th European Conference on Power Electronics and Applications, 5-9 September 2016, Karlsruhe, Germany.

Mouawad, Bassem and Li, Jianfeng and Castellazzi, Alberto and Johnson, Christopher Mark and Erlbacher, Tobias and Friedriches, Peter (2016) Low inductance 2.5kV packaging technology for SiC switches. In: 9th International Conference on Integrated Power Electronics Systems, 08-10 Mar 2016, Nuremberg, Germany.

Mouawad, Bassem and Li, Jianfeng and Castellazzi, Alberto and Johnson, Christopher Mark (2015) Hybrid half-bridge package for high voltage application. In: 28th International Symposium on Power Semiconductor Devices and ICs (ISPSD), 12-16 June 2016, Prague, Czech Republic.

Li, Jianfeng and Gurpinar, Emre and Lopez Arevalo, Saul and Castellazzi, Alberto and Mills, Liam (2014) Built-in reliability design of a high-frequency SiC MOSFET power module. In: 7th International Power Electronics Conference (IPEC Hiroshima 2014 ECCE- ASIA), 18-21 May 2014, Hiroshima, Japan.

Gurpinar, Emre and Lopez Arevalo, Saul and Li, Jianfeng and De, D. and Castellazzi, Alberto and Mills, Liam (2014) Testing of a lightweight SiC power module for avionic applications. In: 7th IET International Conference on Power Electronics, Machines and Drives (PEMD 2014), 8-10 April 2014, Manchester, UK.

Li, Jianfeng and Agyakwa, Pearl and Evans, Paul and Johnson, Christopher Mark and Zhao, Yimin and Wu, Yibo and Evans, Kim (2014) Packaging/assembling technologies for a high performance SiC-based planar power module. In: Greener Aviation Conference 2014: Clean Sky Breakthrough and Worldwide Status, 12-14 March 2014, Brussels, Belgium.

This list was generated on Tue Oct 24 07:52:33 2017 UTC.