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Jump to: Conference or Workshop Item Number of items: 1. Conference or Workshop ItemRajaguru, P. and Bailey, Christopher and Aliyu, Attahir Murtala and Castellazzi, Alberto and Pathirana, V. and Udugampola, N. and Trajkovic, T. and Udrea, F. and Mitchelson, P.D. and Elliot, A.D.T. (2017) Co-design/simulation of flip-chip assembly for high voltage IGBT packages. In: 23rd International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2017, 27-29 September 2018, Amsterdam, Netherlands. |
From the 1st Oct 2021, the research publications and student eTheses of University of Nottingham Ningbo China authors will be handled through the UNNC Research Information System (RIS).
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If you are a UNNC author, please login to the UNNC RIS in order to deposit articles and etheses after this date, or contact Library@nottingham.edu.cn if you have any enquiries in regard to this change.
