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Conference or Workshop Item

Rajaguru, P. and Bailey, Christopher and Aliyu, Attahir Murtala and Castellazzi, Alberto and Pathirana, V. and Udugampola, N. and Trajkovic, T. and Udrea, F. and Mitchelson, P.D. and Elliot, A.D.T. (2017) Co-design/simulation of flip-chip assembly for high voltage IGBT packages. In: 23rd International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2017, 27-29 September 2018, Amsterdam, Netherlands.

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