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Jump to: Article | Conference or Workshop Item Number of items: 2. ArticleRajaguru, P. and Lu, H. and Bailey, C. and Castellazzi, A. and Pathirana, V. and Udugampola, N. and Udrea, F. (2018) Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables. Microelectronics Reliability, 83 . pp. 146-156. ISSN 0026-2714 Conference or Workshop ItemAliyu, Attahir Murtala and Mouawad, Bassem and Castellazzi, Alberto and Rajaguru, P. and Bailey, C. and Pathirana, V. and Udugampola, N. and Trajkovic, T. and Udrea, F. (2017) Chip-on-board assembly of 800V Si L-IGBTs for high performance ultra-compact LED drivers. In: 29th International Symposium on Power Semiconductor Devices and ICs (ISPSD 2017), 28 May - 1 June 2017, Sapporo, Japan. |
From 30 July 2018 the research publications of UK based University of Nottingham authors (excluding student deposited eTheses) will be handled through the Research Information System (RIS).
To deposit an article after this date please Login to RIS and use the Outputs tab to Add New Output.
(See this blog for further information about this transition and the new repository for UK outputs.)
To deposit an article after this date please Login to RIS and use the Outputs tab to Add New Output.
(See this blog for further information about this transition and the new repository for UK outputs.)
