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Number of items: 8.

Article

Arjmand, Elahjeh and Agyakwa, Pearl and Corfield, Martin and Li, Jianfeng and Johnson, Christopher Mark (2016) Predicting lifetime of thick Al wire bonds using signals obtained from ultrasonic generator. IEEE Transactions on Components, Packaging and Manufacturing Technology, 6 (5). pp. 814-821. ISSN 2156-3985

Agyakwa, Pearl and Yang, Li and Arjmand, Elahjeh and Evans, Paul and Corfield, Martin and Johnson, Christopher Mark (2016) Damage evolution in Al wire bonds subjected to a junction temperature fluctuation of 30 K. Journal of Electronic Materials . pp. 1-14. ISSN 1543-186X

Eleffendi, Mohd. Amir and Yang, Li and Agyakwa, Pearl and Johnson, C. Mark (2016) Quantification of cracked area in thermal path of high-powermulti-chip modules using transient thermal impedance measurement. Microelectronics Reliability, 59 . pp. 73-83. ISSN 0026-2714

Wang, Yun and Li, Jianfeng and Agyakwa, Pearl and Johnson, Christopher Mark and Li, Shuguang (2014) Quantitative microstructure characterization of Ag nanoparticle sintered joints for power die attachment. Molecular Crystals and Liquid Crystals, 604 (1). pp. 11-26. ISSN 1542-1406

Li, J.F. and Agyakwa, Pearl and Johnson, Christopher Mark (2014) Interdiffusion coefficients of binary multiphase systems with consideration of variation in Molar volumes. International Journal of Materials Engineering and Technology, 12 (1). pp. 25-36. ISSN 0975-0444

Li, Jianfeng and Agyakwa, Pearl and Johnson, Christopher Mark (2014) Suitable thicknesses of base metal and interlayer, and evolution of phases for Ag/Sn/Ag transient liquid-phase joints used for power die attachment. Journal of Electronic Materials, 43 (4). pp. 983-995. ISSN 0361-5235

Conference or Workshop Item

Li, Jianfeng and Agyakwa, Pearl and Evans, Paul and Johnson, Christopher Mark and Zhao, Yimin and Wu, Yibo and Evans, Kim (2014) Packaging/assembling technologies for a high performance SiC-based planar power module. In: 7th International Power Electronics Conference (IPEC Hiroshima 2014 ECCE-ASIA), 18-21 May 2014, Hiroshima, Japan.

Thesis (University of Nottingham only)

Agyakwa, Pearl (2004) Creep and microstructural development in P91 weldments at elevated temperature. PhD thesis, University of Nottingham.

This list was generated on Mon Aug 21 00:37:43 2017 UTC.