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Number of items: 5.

Agyakwa, Pearl and Yang, Li and Arjmand, Elahjeh and Evans, Paul and Corfield, Martin and Johnson, Christopher Mark (2016) Damage evolution in Al wire bonds subjected to a junction temperature fluctuation of 30 K. Journal of Electronic Materials . pp. 1-14. ISSN 1543-186X

Arjmand, Elahjeh and Agyakwa, Pearl and Corfield, Martin and Li, Jianfeng and Johnson, Christopher Mark (2016) Predicting lifetime of thick Al wire bonds using signals obtained from ultrasonic generator. IEEE Transactions on Components, Packaging and Manufacturing Technology, 6 (5). pp. 814-821. ISSN 2156-3985

Eleffendi, Mohd. Amir and Yang, Li and Agyakwa, Pearl and Johnson, C. Mark (2016) Quantification of cracked area in thermal path of high-powermulti-chip modules using transient thermal impedance measurement. Microelectronics Reliability, 59 . pp. 73-83. ISSN 0026-2714

Wang, Yun and Li, Jianfeng and Agyakwa, Pearl and Johnson, Christopher Mark and Li, Shuguang (2014) Quantitative microstructure characterization of Ag nanoparticle sintered joints for power die attachment. Molecular Crystals and Liquid Crystals, 604 (1). pp. 11-26. ISSN 1542-1406

Li, Jianfeng and Agyakwa, Pearl and Johnson, Christopher Mark (2014) Suitable thicknesses of base metal and interlayer, and evolution of phases for Ag/Sn/Ag transient liquid-phase joints used for power die attachment. Journal of Electronic Materials, 43 (4). pp. 983-995. ISSN 0361-5235

This list was generated on Tue Dec 6 03:02:52 2016 UTC.