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Number of items: 12.

Dai, Jingru, Li, Jianfeng, Agyakwa, Pearl, Corfield, Martin and Johnson, Christopher Mark (2018) Comparative thermal and structural characterization of sintered nano-silver and high-lead solder die attachments during power cycling. IEEE Transactions on Device and Materials Reliability . ISSN 1530-4388 (In Press)

Yang, Li, Agyakwa, Pearl, Corfield, Martin, Johnson, Mark, Harris, Anne, Packwood, Matthew and Paciura, Krzysztof (2018) Comparison of thermal and reliability performance between a SiC MOSFET module with embedded decoupling capacitors and commercial Si IGBT power modules. In: 10th International Conference on Integrated Power Electronics (CIPS 2018), 20-23 Mar 2018, Stuttgart, Germany.

Dai, Jingru, Li, Jianfeng, Agyakwa, Pearl and Johnson, Christopher Mark (2017) Time-efficient sintering processes to attach power devices using nanosilver dry film. Journal of Microelectronics and Electronic Packaging, 14 (4). pp. 140-149. ISSN 1551-4897

Arjmand, Elahjeh, Agyakwa, Pearl, Corfield, Martin, Li, Jianfeng and Johnson, Christopher Mark (2016) Predicting lifetime of thick Al wire bonds using signals obtained from ultrasonic generator. IEEE Transactions on Components, Packaging and Manufacturing Technology, 6 (5). pp. 814-821. ISSN 2156-3985

Agyakwa, Pearl, Yang, Li, Arjmand, Elahjeh, Evans, Paul, Corfield, Martin and Johnson, Christopher Mark (2016) Damage evolution in Al wire bonds subjected to a junction temperature fluctuation of 30 K. Journal of Electronic Materials . pp. 1-14. ISSN 1543-186X

Eleffendi, Mohd. Amir, Yang, Li, Agyakwa, Pearl and Johnson, C. Mark (2016) Quantification of cracked area in thermal path of high-powermulti-chip modules using transient thermal impedance measurement. Microelectronics Reliability, 59 . pp. 73-83. ISSN 0026-2714

Wang, Yun, Li, Jianfeng, Agyakwa, Pearl, Johnson, Christopher Mark and Li, Shuguang (2014) Quantitative microstructure characterization of Ag nanoparticle sintered joints for power die attachment. Molecular Crystals and Liquid Crystals, 604 (1). pp. 11-26. ISSN 1542-1406

Li, J.F., Agyakwa, Pearl and Johnson, Christopher Mark (2014) Interdiffusion coefficients of binary multiphase systems with consideration of variation in Molar volumes. International Journal of Materials Engineering and Technology, 12 (1). pp. 25-36. ISSN 0975-0444

Li, Jianfeng, Agyakwa, Pearl and Johnson, Christopher Mark (2014) Suitable thicknesses of base metal and interlayer, and evolution of phases for Ag/Sn/Ag transient liquid-phase joints used for power die attachment. Journal of Electronic Materials, 43 (4). pp. 983-995. ISSN 0361-5235

Agyakwa, Pearl, Yang, Li, Corfield, Martin and Johnson, Christopher Mark (2014) A non-destructive study of crack development during thermal cycling of Al wire bonds using x-ray computed tomography. In: 8th International Conference on Integrated Power Electronics Systems, 25-27 February 2014, Nuremberg, Germany.

Li, Jianfeng, Agyakwa, Pearl, Evans, Paul, Johnson, Christopher Mark, Zhao, Yimin, Wu, Yibo and Evans, Kim (2014) Packaging/assembling technologies for a high performance SiC-based planar power module. In: Greener Aviation Conference 2014: Clean Sky Breakthrough and Worldwide Status, 12-14 March 2014, Brussels, Belgium.

Agyakwa, Pearl (2004) Creep and microstructural development in P91 weldments at elevated temperature. PhD thesis, University of Nottingham.

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