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Number of items: 4.

Article

Li, Jianfeng and Yaqub, Imran and Corfield, Martin and Johnson, Christopher Mark (2017) Interconnect materials enabling IGBT modules to achieve stable short circuit failure behavior. IEEE Transactions on Components, Packaging, and Manufacturing Technology, 7 (5). pp. 734-744. ISSN 2156-3950

Yaqub, Imran and Li, Jianfeng and Johnson, Christopher Mark (2015) Dependence of overcurrent failure modes of IGBT modules on interconnect technologies. Microelectronics Reliability, 55 (12). pp. 2596-2605. ISSN 0026-2714

Conference or Workshop Item

Li, Jianfeng and Yaqub, Imran and Johnson, Christopher Mark (2016) Selection of materials for IGBT modules to achieve stable short circuit failure behaviour. In: PCIM Asia 2016, 28-30 June 2016, Shanghai, China.

Thesis (University of Nottingham only)

Yaqub, Imran (2015) Investigation into stable failure to short circuit in IGBT power modules. PhD thesis, University of Nottingham.

This list was generated on Sun Jun 20 03:50:09 2021 UTC.