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Number of items: 4. ArticleLi, Jianfeng, Yaqub, Imran, Corfield, Martin and Johnson, Christopher Mark (2017) Interconnect materials enabling IGBT modules to achieve stable short circuit failure behavior. IEEE Transactions on Components, Packaging, and Manufacturing Technology, 7 (5). pp. 734-744. ISSN 2156-3950 Yaqub, Imran, Li, Jianfeng and Johnson, Christopher Mark (2015) Dependence of overcurrent failure modes of IGBT modules on interconnect technologies. Microelectronics Reliability, 55 (12). pp. 2596-2605. ISSN 0026-2714 Conference or Workshop ItemLi, Jianfeng, Yaqub, Imran and Johnson, Christopher Mark (2016) Selection of materials for IGBT modules to achieve stable short circuit failure behaviour. In: PCIM Asia 2016, 28-30 June 2016, Shanghai, China. Thesis (University of Nottingham only)Yaqub, Imran (2015) Investigation into stable failure to short circuit in IGBT power modules. PhD thesis, University of Nottingham. |
