• Login
• Admin

Article

Yang, Li, Li, Ke, Dai, Jingru, Corfield, Martin, Harris, Anne, Paciura, Krzysztof, O'Brien, John and Johnson, C. Mark (2018) Electrical performance and reliability characterization of a SiC MOSFET power module with embedded decoupling capacitors. IEEE Transactions on Power Electronics, 33 (12). pp. 10594-10601. ISSN 1941-0107

Agyakwa, Pearl, Yang, Li, Arjmand, Elahjeh, Evans, Paul, Corfield, Martin and Johnson, Christopher Mark (2016) Damage evolution in Al wire bonds subjected to a junction temperature fluctuation of 30 K. Journal of Electronic Materials . pp. 1-14. ISSN 1543-186X

Eleffendi, Mohd. Amir, Yang, Li, Agyakwa, Pearl and Johnson, C. Mark (2016) Quantification of cracked area in thermal path of high-powermulti-chip modules using transient thermal impedance measurement. Microelectronics Reliability, 59 . pp. 73-83. ISSN 0026-2714

Castellazzi, Alberto, Fayyaz, Asad, Romano, G., Yang, Li, Riccio, M. and Irace, A. (2016) SiC power MOSFETs performance, robustness and technology maturity. Microelectronics Reliability, 58 . pp. 164-176. ISSN 0026-2714

Yang, Li, Agyakwa, Pearl A. and Johnson, C. Mark (2013) Physics-of-failure lifetime prediction models for wire bond interconnects in power electronic modules. IEEE Transactions on Device and Materials Reliability, 13 (1). pp. 9-17. ISSN 1530-4388

Conference or Workshop Item

Yang, Li, Agyakwa, Pearl, Corfield, Martin, Johnson, Mark, Harris, Anne, Packwood, Matthew and Paciura, Krzysztof (2018) Comparison of thermal and reliability performance between a SiC MOSFET module with embedded decoupling capacitors and commercial Si IGBT power modules. In: 10th International Conference on Integrated Power Electronics (CIPS 2018), 20-23 Mar 2018, Stuttgart, Germany.

Agyakwa, Pearl, Yang, Li, Corfield, Martin and Johnson, Christopher Mark (2014) A non-destructive study of crack development during thermal cycling of Al wire bonds using x-ray computed tomography. In: 8th International Conference on Integrated Power Electronics Systems, 25-27 February 2014, Nuremberg, Germany.

Thesis (University of Nottingham only)

Yang, Li (2013) A damage-based time-domain wear-out model for wire bond interconnects in power electronic modules. PhD thesis, University of Nottingham.