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Number of items: 8.

Article

Yang, Li and Li, Ke and Dai, Jingru and Corfield, Martin and Harris, Anne and Paciura, Krzysztof and O'Brien, John and Johnson, C. Mark (2018) Electrical performance and reliability characterization of a SiC MOSFET power module with embedded decoupling capacitors. IEEE Transactions on Power Electronics, 33 (12). pp. 10594-10601. ISSN 1941-0107

Agyakwa, Pearl and Yang, Li and Arjmand, Elahjeh and Evans, Paul and Corfield, Martin and Johnson, Christopher Mark (2016) Damage evolution in Al wire bonds subjected to a junction temperature fluctuation of 30 K. Journal of Electronic Materials . pp. 1-14. ISSN 1543-186X

Eleffendi, Mohd. Amir and Yang, Li and Agyakwa, Pearl and Johnson, C. Mark (2016) Quantification of cracked area in thermal path of high-powermulti-chip modules using transient thermal impedance measurement. Microelectronics Reliability, 59 . pp. 73-83. ISSN 0026-2714

Castellazzi, Alberto and Fayyaz, Asad and Romano, G. and Yang, Li and Riccio, M. and Irace, A. (2016) SiC power MOSFETs performance, robustness and technology maturity. Microelectronics Reliability, 58 . pp. 164-176. ISSN 0026-2714

Yang, Li and Agyakwa, Pearl A. and Johnson, C. Mark (2013) Physics-of-failure lifetime prediction models for wire bond interconnects in power electronic modules. IEEE Transactions on Device and Materials Reliability, 13 (1). pp. 9-17. ISSN 1530-4388

Conference or Workshop Item

Yang, Li and Agyakwa, Pearl and Corfield, Martin and Johnson, Mark and Harris, Anne and Packwood, Matthew and Paciura, Krzysztof (2018) Comparison of thermal and reliability performance between a SiC MOSFET module with embedded decoupling capacitors and commercial Si IGBT power modules. In: 10th International Conference on Integrated Power Electronics (CIPS 2018), 20-23 Mar 2018, Stuttgart, Germany.

Agyakwa, Pearl and Yang, Li and Corfield, Martin and Johnson, Christopher Mark (2014) A non-destructive study of crack development during thermal cycling of Al wire bonds using x-ray computed tomography. In: 8th International Conference on Integrated Power Electronics Systems, 25-27 February 2014, Nuremberg, Germany.

Thesis (University of Nottingham only)

Yang, Li (2013) A damage-based time-domain wear-out model for wire bond interconnects in power electronic modules. PhD thesis, University of Nottingham.

This list was generated on Tue Jun 15 07:05:06 2021 UTC.