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Article

Li, Jianfeng, Johnson, Christopher Mark, Buttay, Cyril, Sabbah, Wissam and Azzopardi, Stéphane (2015) Bonding strength of multiple SiC die attachment prepared by sintering of Ag nanoparticles. Journal of Materials Processing Technology, 215 . pp. 299-308. ISSN 0924-0136

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