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Rajaguru, P. and Lu, H. and Bailey, C. and Castellazzi, A. and Pathirana, V. and Udugampola, N. and Udrea, F. (2018) Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables. Microelectronics Reliability, 83 . pp. 146-156. ISSN 0026-2714

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