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Jump to: 2018 Number of items: 2. 2018Zeng, Y., Hussein, A. and Castellazzi, A. (2018) Individual device active cooling for enhanced system-level power density and more uniform temperature distribution. In: 2018 IEEE 30th International Symposium on Power Semiconductor Devices and ICs (ISPSD), 13-17 May 2018, Chicago, USA. Zeng, Y., Gurpinar, Emre, Hussein, A. and Castellazzi, Alberto (2018) Experimental demonstration of an optimised PWM scheme for more even device electro-thermal stress in a 3-Level ANPC GaN inverter. In: 9th International Conference on Power Electronics, Machines and Drives (PEMD 2018), 17-19 April 2018, Liverpool, UK. |
