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Li, Jianfeng, Dai, Jingru and Johnson, Christopher Mark (2018) Comparison of power cycling reliability of flexible PCB interconnect smaller/thinner and larger/thicker power devices with topside Sn-3.5Ag solder joints. Microelectronics Reliability, 84 . pp. 55-65. ISSN 0026-2714

Yang, Li, Li, Ke, Dai, Jingru, Corfield, Martin, Harris, Anne, Paciura, Krzysztof, O'Brien, John and Johnson, C. Mark (2018) Electrical performance and reliability characterization of a SiC MOSFET power module with embedded decoupling capacitors. IEEE Transactions on Power Electronics, 33 (12). pp. 10594-10601. ISSN 1941-0107

Dai, Jingru, Li, Jianfeng, Agyakwa, Pearl, Corfield, Martin and Johnson, Christopher Mark (2018) Comparative thermal and structural characterization of sintered nano-silver and high-lead solder die attachments during power cycling. IEEE Transactions on Device and Materials Reliability . ISSN 1530-4388 (In Press)

Zhang, Hui, Li, Jianfeng, Dai, Jingru, Corfield, Martin, Liu, Xuejian, Liu, Yan, Huang, Zhengren and Johnson, Christopher Mark (2018) Improved reliability of planar power interconnect with ceramic-based structure. IEEE Journal of Emerging and Selected Topics in Power Electronics, 6 (1). pp. 175-187. ISSN 2168-6785

Dai, Jingru, Li, Jianfeng, Agyakwa, Pearl and Johnson, Christopher Mark (2017) Time-efficient sintering processes to attach power devices using nanosilver dry film. Journal of Microelectronics and Electronic Packaging, 14 (4). pp. 140-149. ISSN 1551-4897

Thesis (University of Nottingham only)

Dai, Jingru (2019) Process and reliability of die attachment by time-reduced sintering of nanosilver film. PhD thesis, University of Nottingham.