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Yang, Li, Li, Ke, Dai, Jingru, Corfield, Martin, Harris, Anne, Paciura, Krzysztof, O'Brien, John and Johnson, C. Mark (2018) Electrical performance and reliability characterization of a SiC MOSFET power module with embedded decoupling capacitors. IEEE Transactions on Power Electronics, 33 (12). pp. 10594-10601. ISSN 1941-0107

Dai, Jingru, Li, Jianfeng, Agyakwa, Pearl, Corfield, Martin and Johnson, Christopher Mark (2018) Comparative thermal and structural characterization of sintered nano-silver and high-lead solder die attachments during power cycling. IEEE Transactions on Device and Materials Reliability . ISSN 1530-4388 (In Press)

Yang, Li, Agyakwa, Pearl, Corfield, Martin, Johnson, Mark, Harris, Anne, Packwood, Matthew and Paciura, Krzysztof (2018) Comparison of thermal and reliability performance between a SiC MOSFET module with embedded decoupling capacitors and commercial Si IGBT power modules. In: 10th International Conference on Integrated Power Electronics (CIPS 2018), 20-23 Mar 2018, Stuttgart, Germany.

Zhang, Hui, Li, Jianfeng, Dai, Jingru, Corfield, Martin, Liu, Xuejian, Liu, Yan, Huang, Zhengren and Johnson, Christopher Mark (2018) Improved reliability of planar power interconnect with ceramic-based structure. IEEE Journal of Emerging and Selected Topics in Power Electronics, 6 (1). pp. 175-187. ISSN 2168-6785

Li, Jianfeng, Yaqub, Imran, Corfield, Martin and Johnson, Christopher Mark (2017) Interconnect materials enabling IGBT modules to achieve stable short circuit failure behavior. IEEE Transactions on Components, Packaging, and Manufacturing Technology, 7 (5). pp. 734-744. ISSN 2156-3950

Arjmand, Elahjeh, Agyakwa, Pearl, Corfield, Martin, Li, Jianfeng and Johnson, Christopher Mark (2016) Predicting lifetime of thick Al wire bonds using signals obtained from ultrasonic generator. IEEE Transactions on Components, Packaging and Manufacturing Technology, 6 (5). pp. 814-821. ISSN 2156-3985

Agyakwa, Pearl, Yang, Li, Arjmand, Elahjeh, Evans, Paul, Corfield, Martin and Johnson, Christopher Mark (2016) Damage evolution in Al wire bonds subjected to a junction temperature fluctuation of 30 K. Journal of Electronic Materials . pp. 1-14. ISSN 1543-186X

Li, Jianfeng, Castellazzi, Alberto, Dai, Tianxiang, Corfield, Martin, Solomon, Adane Kassa and Johnson, Christopher Mark (2015) Built-in reliability design of highly integrated solid-state power switches with metal bump interconnects. IEEE Transactions on Power Electronics, 30 (5). pp. 2587-2600. ISSN 0885-8993

Li, Jianfeng, Castellazzi, Alberto, Dai, Tianxiang, Corfield, Martin, Solomon, Adane Kassa and Johnson, Christopher Mark (2015) Built-in reliability design of highly integrated solid-state power switches with metal bump interconnects. IEEE Transactions on Power Electronics, 30 (5). pp. 2587-2600. ISSN 0885-8993

Agyakwa, Pearl, Yang, Li, Corfield, Martin and Johnson, Christopher Mark (2014) A non-destructive study of crack development during thermal cycling of Al wire bonds using x-ray computed tomography. In: 8th International Conference on Integrated Power Electronics Systems, 25-27 February 2014, Nuremberg, Germany.