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Li, Jianfeng and Johnson, Christopher Mark and Buttay, Cyril and Sabbah, Wissam and Azzopardi, St├ęphane (2015) Bonding strength of multiple SiC die attachment prepared by sintering of Ag nanoparticles. Journal of Materials Processing Technology, 215 . pp. 299-308. ISSN 0924-0136

This list was generated on Sat Jun 19 23:01:00 2021 UTC.