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Jump to: Article Number of items: 1. ArticleArjmand, E., Agyakwa, P.A. and Johnson, C.M. (2014) Reliability of thick Al wire: a study of the effects of wire bonding parameters on thermal cycling degradation rate using non-destructive methods. Microelectronics Reliability, 54 (9-10). pp. 2006-2012. ISSN 0026-2714 |
