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Number of items: 4. Li, Jianfeng, Yaqub, Imran, Corfield, Martin and Johnson, Christopher Mark (2017) Interconnect materials enabling IGBT modules to achieve stable short circuit failure behavior. IEEE Transactions on Components, Packaging, and Manufacturing Technology, 7 (5). pp. 734-744. ISSN 2156-3950 Li, Jianfeng, Yaqub, Imran and Johnson, Christopher Mark (2016) Selection of materials for IGBT modules to achieve stable short circuit failure behaviour. In: PCIM Asia 2016, 28-30 June 2016, Shanghai, China. Yaqub, Imran (2015) Investigation into stable failure to short circuit in IGBT power modules. PhD thesis, University of Nottingham. Yaqub, Imran, Li, Jianfeng and Johnson, Christopher Mark (2015) Dependence of overcurrent failure modes of IGBT modules on interconnect technologies. Microelectronics Reliability, 55 (12). pp. 2596-2605. ISSN 0026-2714 |
