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Jump to: Conference or Workshop Item Number of items: 1. Conference or Workshop ItemYang, Li and Agyakwa, Pearl and Corfield, Martin and Johnson, Mark and Harris, Anne and Packwood, Matthew and Paciura, Krzysztof (2018) Comparison of thermal and reliability performance between a SiC MOSFET module with embedded decoupling capacitors and commercial Si IGBT power modules. In: 10th International Conference on Integrated Power Electronics (CIPS 2018), 20-23 Mar 2018, Stuttgart, Germany. |
From 30 July 2018 the research publications of UK based University of Nottingham authors (excluding student deposited eTheses) will be handled through the Research Information System (RIS).
To deposit an article after this date please Login to RIS and use the Outputs tab to Add New Output.
(See this blog for further information about this transition and the new repository for UK outputs.)
To deposit an article after this date please Login to RIS and use the Outputs tab to Add New Output.
(See this blog for further information about this transition and the new repository for UK outputs.)
