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Conference or Workshop Item

Yang, Li and Agyakwa, Pearl and Corfield, Martin and Johnson, Mark and Harris, Anne and Packwood, Matthew and Paciura, Krzysztof (2018) Comparison of thermal and reliability performance between a SiC MOSFET module with embedded decoupling capacitors and commercial Si IGBT power modules. In: 10th International Conference on Integrated Power Electronics (CIPS 2018), 20-23 Mar 2018, Stuttgart, Germany.

This list was generated on Fri Mar 5 19:43:36 2021 UTC.