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Chen, H. and Hyde, T.H. and Voisey, K.T. and McCartney, D.G. (2013) Application of small punch creep testing to a thermally sprayed CoNiCrAlY bond coat. Materials Science and Engineering: A, 585 . pp. 205-213. ISSN 0921-5093

Saber, Mohammed and Sun, Wei and Hyde, T.H. (2016) Numerical study of the effects of crack location on creep crack growth in weldment. Engineering Fracture Mechanics, 154 . pp. 72-82. ISSN 0013-7944

Cortellino, Francesco and Sun, Wei and Hyde, T.H. (2016) On the effects of friction modelling on small punch creep test responses: a numerical investigation. Journal of Strain Analysis for Engineering Design . ISSN 2041-3130

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