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Article

Zhang, Hui and Li, Jianfeng and Dai, Jingru and Corfield, Martin and Liu, Xuejian and Liu, Yan and Huang, Zhengren and Johnson, Christopher Mark (2018) Improved reliability of planar power interconnect with ceramic-based structure. IEEE Journal of Emerging and Selected Topics in Power Electronics, 6 (1). pp. 175-187. ISSN 2168-6785

This list was generated on Thu Apr 19 00:28:22 2018 UTC.