Browse by Authors and EditorsJump to: Article Number of items: 2. ArticleEleffendi, Mohd. Amir, Yang, Li, Agyakwa, Pearl and Johnson, C. Mark (2016) Quantification of cracked area in thermal path of high-powermulti-chip modules using transient thermal impedance measurement. Microelectronics Reliability, 59 . pp. 73-83. ISSN 0026-2714 Eleffendi, Mohd. Amir and Johnson, Christopher Mark (2015) Application of Kalman filter to estimate junction temperature in IGBT power modules. IEEE Transactions on Power Electronics, 31 (2). pp. 1576-1587. ISSN 0885-8993 |