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Number of items: 6.


Li, Jianfeng and Dai, Jingru and Johnson, Christopher Mark (2018) Comparison of power cycling reliability of flexible PCB interconnect smaller/thinner and larger/thicker power devices with topside Sn-3.5Ag solder joints. Microelectronics Reliability, 84 . pp. 55-65. ISSN 0026-2714

Yang, Li and Li, Ke and Dai, Jingru and Corfield, Martin and Harris, Anne and Paciura, Krzysztof and O'Brien, John and Johnson, C. Mark (2018) Electrical performance and reliability characterization of a SiC MOSFET power module with embedded decoupling capacitors. IEEE Transactions on Power Electronics, 33 (12). pp. 10594-10601. ISSN 1941-0107

Dai, Jingru and Li, Jianfeng and Agyakwa, Pearl and Corfield, Martin and Johnson, Christopher Mark (2018) Comparative thermal and structural characterization of sintered nano-silver and high-lead solder die attachments during power cycling. IEEE Transactions on Device and Materials Reliability . ISSN 1530-4388 (In Press)

Zhang, Hui and Li, Jianfeng and Dai, Jingru and Corfield, Martin and Liu, Xuejian and Liu, Yan and Huang, Zhengren and Johnson, Christopher Mark (2018) Improved reliability of planar power interconnect with ceramic-based structure. IEEE Journal of Emerging and Selected Topics in Power Electronics, 6 (1). pp. 175-187. ISSN 2168-6785

Dai, Jingru and Li, Jianfeng and Agyakwa, Pearl and Johnson, Christopher Mark (2017) Time-efficient sintering processes to attach power devices using nanosilver dry film. Journal of Microelectronics and Electronic Packaging, 14 (4). pp. 140-149. ISSN 1551-4897

Thesis (University of Nottingham only)

Dai, Jingru (2019) Process and reliability of die attachment by time-reduced sintering of nanosilver film. PhD thesis, University of Nottingham.

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