Browse by Authors and Editors

Up a level
Export as [feed] RSS 1.0 [feed] RSS 2.0
Group by: Item Type | Date | No Grouping
Number of items: 7.

Article

Zhang, Hui and Li, Jianfeng and Dai, Jingru and Corfield, Martin and Liu, Xuejian and Liu, Yan and Huang, Zhengren and Johnson, Christopher Mark (2017) Improved reliability of planar power interconnect with ceramic-based structure. IEEE Journal of Emerging and Selected Topics in Power Electronics . ISSN 2168-6785 (In Press)

Li, Jianfeng and Yaqub, Imran and Corfield, Martin and Johnson, Christopher Mark (2017) Interconnect materials enabling IGBT modules to achieve stable short circuit failure behavior. IEEE Transactions on Components, Packaging, and Manufacturing Technology, 7 (5). pp. 734-744. ISSN 2156-3950

Arjmand, Elahjeh and Agyakwa, Pearl and Corfield, Martin and Li, Jianfeng and Johnson, Christopher Mark (2016) Predicting lifetime of thick Al wire bonds using signals obtained from ultrasonic generator. IEEE Transactions on Components, Packaging and Manufacturing Technology, 6 (5). pp. 814-821. ISSN 2156-3985

Agyakwa, Pearl and Yang, Li and Arjmand, Elahjeh and Evans, Paul and Corfield, Martin and Johnson, Christopher Mark (2016) Damage evolution in Al wire bonds subjected to a junction temperature fluctuation of 30 K. Journal of Electronic Materials . pp. 1-14. ISSN 1543-186X

Li, Jianfeng and Castellazzi, Alberto and Dai, Tianxiang and Corfield, Martin and Solomon, Adane Kassa and Johnson, Christopher Mark (2015) Built-in reliability design of highly integrated solid-state power switches with metal bump interconnects. IEEE Transactions on Power Electronics, 30 (5). pp. 2587-2600. ISSN 0885-8993

Li, Jianfeng and Castellazzi, Alberto and Dai, Tianxiang and Corfield, Martin and Solomon, Adane Kassa and Johnson, Christopher Mark (2015) Built-in reliability design of highly integrated solid-state power switches with metal bump interconnects. IEEE Transactions on Power Electronics, 30 (5). pp. 2587-2600. ISSN 0885-8993

Conference or Workshop Item

Agyakwa, Pearl and Yang, Li and Corfield, Martin and Johnson, Christopher Mark (2014) A non-destructive study of crack development during thermal cycling of Al wire bonds using x-ray computed tomography. In: 8th International Conference on Integrated Power Electronics Systems, 25-27 February 2014, Nuremberg, Germany.

This list was generated on Wed Oct 18 03:34:12 2017 UTC.