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Arjmand, Elaheh and Agyakwa, Pearl A. and Corfield, Martin R. and Li, Jianfeng and Mouawad, Bassem and Mark Johnson, C. (2016) A thermal cycling reliability study of ultrasonically bonded copper wires. Microelectronics Reliability, 59 . pp. 126-133. ISSN 0026-2714

Thesis (University of Nottingham only)

Arjmand, Elaheh (2016) On-line quality monitoring and lifetime prediction of thick Al wire bonds using signals obtained from ultrasonic generator. PhD thesis, University of Nottingham.

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