Browse by Authors and Editors

Up a level
Export as [feed] RSS 1.0 [feed] RSS 2.0
Number of items: 1.

Arjmand, E. and Agyakwa, P.A. and Johnson, C.M. (2014) Reliability of thick Al wire: a study of the effects of wire bonding parameters on thermal cycling degradation rate using non-destructive methods. Microelectronics Reliability, 54 (9-10). pp. 2006-2012. ISSN 0026-2714

This list was generated on Sun May 28 08:55:30 2017 UTC.