Browse by Authors and Editors
Number of items: 3. 2016Arjmand, Elaheh and Agyakwa, Pearl A. and Corfield, Martin R. and Li, Jianfeng and Mouawad, Bassem and Mark Johnson, C. (2016) A thermal cycling reliability study of ultrasonically bonded copper wires. Microelectronics Reliability, 59 . pp. 126-133. ISSN 0026-2714 Li, Jianfeng and Agyakwa, Pearl A. and Johnson, C. Mark (2016) Response to comments on “A numerical method to determine interdiffusion coefficients of Cu6Sn5 and Cu3Sn intermetallic compounds”. Intermetallics, 69 . pp. 128-130. ISSN 0966-9795 2013Yang, Li and Agyakwa, Pearl A. and Johnson, C. Mark (2013) Physics-of-failure lifetime prediction models for wire bond interconnects in power electronic modules. IEEE Transactions on Device and Materials Reliability, 13 (1). pp. 9-17. ISSN 1530-4388 |
From 30 July 2018 the research publications of UK based University of Nottingham authors (excluding student deposited eTheses) will be handled through the Research Information System (RIS).
To deposit an article after this date please Login to RIS and use the Outputs tab to Add New Output.
(See this blog for further information about this transition and the new repository for UK outputs.)
To deposit an article after this date please Login to RIS and use the Outputs tab to Add New Output.
(See this blog for further information about this transition and the new repository for UK outputs.)
