Thermal management of electronics devices with PCMs filled pin-fin heat sinks: a comparison

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Arshad, Adeel and Ali, Hafiz Muhammad and Jabbal, Mark and Verdin, P.G. (2017) Thermal management of electronics devices with PCMs filled pin-fin heat sinks: a comparison. International Journal of Heat and Mass Transfer, 117 . pp. 1199-1204. ISSN 0017-9310

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Official URL: https://www.sciencedirect.com/science/article/pii/S0017931017329307

Abstract

The present paper covers the comparison of two different configurations (square and circular) pinfin heat sinks embedded with two different phase change materials (PCMs) namely paraffin wax and n-eicosane having different thermo-physical properties were carried out for passive cooling of electronic devices. The pin-fins, acting as thermal conductivity enhancers (TCEs), of 2

Item Type:	Article
Keywords:	Phase Change Materials (PCMs), Thermal Conductivity Enhancers (TCEs), pin-fin Heat Sinks, paraffin wax, n-eicosane, Set Point Temperatures (SPTs)
Schools/Departments:	University of Nottingham, UK > Faculty of Engineering > Department of Mechanical, Materials and Manufacturing Engineering
Identification Number:	https://doi.org/10.1016/j.ijheatmasstransfer.2017.10.065
Depositing User:	Jabbal, Mark
Date Deposited:	30 Oct 2017 09:25
Last Modified:	06 Nov 2017 19:59
URI:	http://eprints.nottingham.ac.uk/id/eprint/47633

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