A non-destructive study of crack development during thermal cycling of Al wire bonds using x-ray computed tomography

Agyakwa, Pearl and Yang, Li and Corfield, Martin and Johnson, Christopher Mark (2014) A non-destructive study of crack development during thermal cycling of Al wire bonds using x-ray computed tomography. In: 8th International Conference on Integrated Power Electronics Systems, 25-27 February 2014, Nuremberg, Germany.

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Abstract

This paper concerns the non-destructive visualisation of the evolution of damage within ultrasonically bonded alumini-um wires using three dimensional x-ray computed tomography. We demonstrate the potential to observe the progressive accumulation of damage within the same wires during passive thermal cycling between -55°C and 190°C. Tomography datasets were obtained prior to and after cycling. Cracks could be seen emerging from the extreme ends of the bonds when imaged after 105 cycles. Subsequent cycling lead to the advancement of these cracks toward the centres of the bonds. In addition, damage developed within the interior of the bonds; these also grew with increase in number of cy¬cles, and merged with existing cracks. Virtual cross-sections have been analysed to quantify the rate of damage build up.

Item Type: Conference or Workshop Item (Paper)
Additional Information: ISBN 978-3-8007-3578-5. © 2014 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
Schools/Departments: University of Nottingham, UK > Faculty of Engineering > Department of Electrical and Electronic Engineering
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Depositing User: Burns, Rebecca
Date Deposited: 08 Sep 2017 09:59
Last Modified: 08 Sep 2017 19:09
URI: http://eprints.nottingham.ac.uk/id/eprint/45546

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