Thermal design and characterization of a modular integrated liquid cooled 1200 V-35 A SiC MOSFET bi-directional switch

Cova, P. and Aliyu, Attahir Murtala and Castellazzi, Alberto and Chiozzi, D. and Delmonte, N. and Lasserre, P. and Pignoloni, N. (2017) Thermal design and characterization of a modular integrated liquid cooled 1200 V-35 A SiC MOSFET bi-directional switch. Microelectronics Reliability, 76-77 . pp. 277-281. ISSN 0026-2714

Full text not available from this repository.

Abstract

The aim of this work is the thermal design of a modular direct liquid cooled package for 1200 V–35 A SiC power MOSFETs, in order to take full advantage of the high power density and high frequency performance of these devices, in the development of a modular integrated solution for power converters. An accurate electro-thermal fluid dynamic model is set up and validated by thermal characterization on a prototype; numerical models have been used to study the internal temperature distribution and to propose further optimization.

Item Type: Article
RIS ID: https://nottingham-repository.worktribe.com/output/872006
Keywords: High power density; Packaging; System integration; Thermal design; Liquid cooling
Schools/Departments: University of Nottingham, UK > Faculty of Engineering
Identification Number: https://doi.org/10.1016/j.microrel.2017.06.062
Depositing User: Eprints, Support
Date Deposited: 17 Jul 2017 10:19
Last Modified: 04 May 2020 18:54
URI: http://eprints.nottingham.ac.uk/id/eprint/44221

Actions (Archive Staff Only)

Edit View Edit View