Packaging/assembling technologies for a high performance SiC-based planar power module

Li, Jianfeng and Agyakwa, Pearl and Evans, Paul and Johnson, Christopher Mark and Zhao, Yimin and Wu, Yibo and Evans, Kim (2014) Packaging/assembling technologies for a high performance SiC-based planar power module. In: 7th International Power Electronics Conference (IPEC Hiroshima 2014 ECCE-ASIA), 18-21 May 2014, Hiroshima, Japan.

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Abstract

This work is to investigate the relevant packaging / assembling technologies for developing a SiC-based planar power module which is aimed to meet the requirements such as operating temperature of -60 °C to 200 °C, SiC devices connected to 540 V DC bus and non-hermetic module. The results reported in this paper include: (i) design of a compact wire-less SiC-based power module with low parasitic inductance; (ii) demonstrated feasibility and reliability for the sintering of Ag nanoparticles and flexible printed circuit board as alternative joining and interconnect technologies which have been selected to assemble the designed power module; and (iii) preliminary construction of the designed module and electrical switching test of the constructed module.

Item Type: Conference or Workshop Item (Paper)
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Schools/Departments: University of Nottingham, UK > Faculty of Engineering > Department of Electrical and Electronic Engineering
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Depositing User: Burns, Rebecca
Date Deposited: 17 Jul 2017 08:33
Last Modified: 18 Jul 2017 17:43
URI: http://eprints.nottingham.ac.uk/id/eprint/44168

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