Sintered-silver bonding of high-temperature piezoelectric ceramic sensors

Billore, Justine, Hascoët, Stanislas, Robutel, Rémi, Buttay, Cyril and Li, Jianfeng (2017) Sintered-silver bonding of high-temperature piezoelectric ceramic sensors. IEEE Transactions on Components, Packaging and Manufacturing Technology, 7 (1). pp. 3-9. ISSN 2156-3985

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Silver sintering is used to bond five components together, in order to form a piezoelectric sensor. A description is provided of the preparation of these components, and of the manufacturing steps, which are carried out at a low temperature (280 °C).

The resulting sensor assemblies are then characterized: cross-sectional views show that the silver layer has a very dense struc-ture, with less than 1 % porosity, although further focused-ion beam investigations show that this porosity is closer to 15 %. The shear strength is approximately 30 MPa. The Young's modulus of the silver bondline is measured using nanoindentation, and is found to be comparable with that of bulk silver (56.6 GPa). Finally, a silver-sintered sensor is compared with a sensor bonded using conventional techniques, showing that an improvement in sensitivity by a factor of more than 3 is achieved.

Item Type: Article
Additional Information: c2017 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other users, including reprinting/ republishing this material for advertising or promotional purposes, creating new collective works for resale or redistribution to servers or lists, or reuse of any copyrighted components of this work in other works.
Keywords: Silver, Temperature sensors, Vibrations, Bonding, Ceramics
Schools/Departments: University of Nottingham, UK > Faculty of Engineering > Department of Electrical and Electronic Engineering
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Depositing User: Burns, Rebecca
Date Deposited: 14 Jul 2017 08:00
Last Modified: 04 May 2020 18:28

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