Laser ultrasound measurement of diaphragm thickness, Young’s modulus and Poisson’s ratio in a MEMS device

McKee, Campbell, Culshaw, Brian and Leach, Richard K. (2016) Laser ultrasound measurement of diaphragm thickness, Young’s modulus and Poisson’s ratio in a MEMS device. IEEE Journal of Selected Topics in Quantum Electronics . ISSN 1558-4542

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Laser-generated Lamb waves, coupled with a large bandwidth Michelson interferometer, have been demonstrated to accurately measure the thickness of a MEMS pressure sensor diaphragm in the [110] direction of a silicon wafer. Using the reassigned Gabor time-frequency method to produce group velocity dispersion curves, the technique facilitates the measurement of thickness, Young’s modulus and Poisson’s ratio from just one non-contact measurement. In this investigation, thickness was determined to be 35.01 μm ± 0.18 μm. For comparison, the thickness was measured using an independent optical technique; obtaining a value of 34.60 μm ± 0.27 μm. Values for Young’s modulus and Poisson’s ratio were also determined to be 163 GPa ± 11.7 GPa and 0.351 respectively and these are in good agreement with values found in the literature.

Item Type: Article
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Keywords: Elastic modulus, Elasticity, Laser ultrasonics, Microelectromechanical systems (MEMS), Poisson’s ratio, Silicon, Young’s modulus
Schools/Departments: University of Nottingham, UK > Faculty of Engineering
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Depositing User: Eprints, Support
Date Deposited: 21 Feb 2017 14:25
Last Modified: 04 May 2020 18:27

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