Hybrid half-bridge package for high voltage application
Mouawad, Bassem and Li, Jianfeng and Castellazzi, Alberto and Johnson, Christopher Mark (2015) Hybrid half-bridge package for high voltage application. In: 28th International Symposium on Power Semiconductor Devices and ICs (ISPSD), 12-16 June 2016, Prague, Czech Republic.
3D power module structures allow for better cooling and lower parasitic inductances compared with the classical planar technology. In this paper, we present a hybrid half-bridge in a 3D packaging configuration, dedicated for high voltage application. A dynamic electrical test of the package is presented.
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