Response to comments on “A numerical method to determine interdiffusion coefficients of Cu6Sn5 and Cu3Sn intermetallic compounds”

Li, Jianfeng and Agyakwa, Pearl A. and Johnson, C. Mark (2016) Response to comments on “A numerical method to determine interdiffusion coefficients of Cu6Sn5 and Cu3Sn intermetallic compounds”. Intermetallics, 69 . pp. 128-130. ISSN 0966-9795

[img]
Preview
PDF - Requires a PDF viewer such as GSview, Xpdf or Adobe Acrobat Reader
Available under Licence Creative Commons Attribution Non-commercial No Derivatives.
Download (266kB) | Preview

Abstract

Comments have recently been made by Yuan et al. [1] to deny one statement in our paper [2], Eq. (21) in Wagner's paper [3] can be used to accurately calculate the integrated interdiffusion coefficient for an incremental diffusion couple only under the assumption of constant Molar volume for all phases. We respond here to explain how they misunderstood our mathematical deduction, made a mistake in deriving a couple of equations, falsely cited our work and employed unjustifiable assumption. As a result, we believe that their comments are invalid to deny our statement.

Item Type: Article
Keywords: Intermetallics; miscellaneous; diffusion; phase interfaces
Schools/Departments: University of Nottingham UK Campus > Faculty of Engineering > Department of Electrical and Electronic Engineering
Identification Number: https://doi.org/10.1016/j.intermet.2015.10.016
Depositing User: Aldred, Mr Ben
Date Deposited: 19 Jul 2016 15:21
Last Modified: 01 Nov 2016 18:19
URI: http://eprints.nottingham.ac.uk/id/eprint/33385

Actions (Archive Staff Only)

Edit View Edit View