Predicting lifetime of thick Al wire bonds using signals obtained from ultrasonic generator

Arjmand, Elahjeh and Agyakwa, Pearl and Corfield, Martin and Li, Jianfeng and Johnson, Christopher Mark (2016) Predicting lifetime of thick Al wire bonds using signals obtained from ultrasonic generator. IEEE Transactions on Components, Packaging and Manufacturing Technology, 6 (5). pp. 814-821. ISSN 2156-3985

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Abstract

Routine monitoring of the wire bonding process requires real-time evaluation and control of wire bond quality. In this paper, we present a nondestructive technique for detecting bond quality by the application of a semisupervised classification algorithm to process the signals obtained from an ultrasonic generator. Experimental tests verified that the classification method is capable of accurately predicting bond quality, indicated by bonded area measured by X-ray tomography. Samples classified during bonding were subjected to temperature cycling between -55 °C and +125 °C, and the distribution of bond life amongst the different classes was analyzed. It is demonstrated that the as-bonded quality classification is closely correlated with thermal cycling life and can, therefore, be used as a nondestructive tool for monitoring bond quality and predicting useful service life.

Item Type: Article
Additional Information: 2016 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other users, including reprinting/ republishing this material for advertising or promotional purposes, creating new collective works for resale or redistribution to servers or lists, or reuse of any copyrighted components of this work in other works.
Keywords: Electronics packaging; Forecasting; Nanocomposites; Quality control; Ultrasonic applications; Ultrasonic equipment; Ultrasonic waves; Wire Classification methods; Non-destructive technique; Nondestructive tools; Quality classification; Real time evaluation; Semi-supervised classification; Temperature cycling; Ultrasonic generator Engineering main heading: Ultrasonic testing
Schools/Departments: University of Nottingham UK Campus > Faculty of Engineering > Department of Electrical and Electronic Engineering
Identification Number: https://doi.org/10.1109/TCPMT.2016.2543001
Depositing User: Burns, Rebecca
Date Deposited: 25 May 2016 07:15
Last Modified: 14 Sep 2016 13:20
URI: http://eprints.nottingham.ac.uk/id/eprint/33374

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