Built-in reliability design of highly integrated solid-state power switches with metal bump interconnects

Li, Jianfeng and Castellazzi, Alberto and Dai, Tianxiang and Corfield, Martin and Solomon, Adane Kassa and Johnson, Christopher Mark (2015) Built-in reliability design of highly integrated solid-state power switches with metal bump interconnects. IEEE Transactions on Power Electronics, 30 (5). pp. 2587-2600. ISSN 0885-8993

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Abstract

A stacked substrate-chip-bump-chip-substrate assembly has been demonstrated in the construction of power switch modules with high power density and good electrical performance. In the present work, special effort has been devoted to material selection and geometric shape of the bumps in the design for improving the thermo-mechanical reliability of a highly integrated bi-directional switch. Results from Three-dimensional finite element simulation indicate that for all design cases the maximum von Mises stresses and creep strain accumulations occur in the solder joints used to join bumps on IGBTs during a realistic mission profile, but occur in the solder joints used to join bumps on DBC substrates during accelerated thermal cycling. The results from both the simulation and the accelerated thermal cycling experiments reveal that selection of Cu/Mo/Cu composite brick bumps in the stacked assembly can significantly improve the thermo-mechanical reliability of both the solder joints and the DBC substrates when compared to Cu cylinder bumps and Cu hollow cylinder bumps reported in previous work. Such results can be attributed to the effective reduction in the extent of mismatch of coefficients of thermal expansion between the different components in the assembly.

Item Type: Article
Additional Information: c2014 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other users, including reprinting/ republishing this material for advertising or promotional purposes, creating new collective works for resale or redistribution to servers or lists, or reuse of any copyrighted components of this work in other works.
Keywords: Integration, wire-less packaging, Cu/Mo/Cu composite, finite element method, thermal cycling
Schools/Departments: University of Nottingham UK Campus > Faculty of Engineering > Department of Electrical and Electronic Engineering
Identification Number: https://doi.org/10.1109/TPEL.2014.2357334
Depositing User: Burns, Rebecca
Date Deposited: 17 May 2016 13:32
Last Modified: 18 Sep 2016 02:31
URI: http://eprints.nottingham.ac.uk/id/eprint/33353

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