Physics-of-failure lifetime prediction models for wire bond interconnects in power electronic modules

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Yang, Li, Agyakwa, Pearl A. and Johnson, C. Mark (2013) Physics-of-failure lifetime prediction models for wire bond interconnects in power electronic modules. IEEE Transactions on Device and Materials Reliability, 13 (1). pp. 9-17. ISSN 1530-4388

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Abstract

This paper presents a review of the commonly adopted physics-of-failure-based life prediction models for wire

bond interconnects in power electronic modules. In the discussed models, lifetime is generally accounted for by loading temperature extremes alone. The influence of the time spent at temperature on bond wear-out behavior and damage removal phenomena resulting from thermally activated processes is not addressed. The phenomenological

considerations based on some unusual observations

highlight the need for new approaches to wire bond life prediction models and thus motivate the proposal of a new time-domain damage-based crack propagation model.

Item Type: Article
RIS ID: https://nottingham-repository.worktribe.com/output/1002779
Schools/Departments: University of Nottingham, UK > Faculty of Engineering
Identification Number: https://doi.org/10.1109/TDMR.2012.2235836
Depositing User: Davies, Mrs Sarah
Date Deposited: 17 Apr 2014 12:53
Last Modified: 04 May 2020 20:19
URI: https://eprints.nottingham.ac.uk/id/eprint/2422

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